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发明名称
RESIN SEALING DEVICE FOR SEMICONDUCTOR ELEMENT AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH03227538(A)
申请公布日期
1991.10.08
申请号
JP19900023902
申请日期
1990.02.01
申请人
MITSUBISHI ELECTRIC CORP
发明人
UCHIDA TETSUYA;TANAKA MINORU
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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