| 摘要 |
PURPOSE:To enable heat generated by a TAB(Tape Automated Bonding) IC to be radiated efficiently through a cap by forming a capacity element or a resistance element on an inner layer of a wiring circuit board. CONSTITUTION:A capacity element 1-7 is formed within a wiring circuit board 1-1, where one is connected to a grounding terminal of a TAB IC, while the other is connected to a power supply terminal through an internal wiring 1-5. A TAB IC 1-2 is packaged in the wiring circuit board 1-1, a lead 1-3 of the TAB IC 1-2 is connected to a pad for lead 1-4, a die of the TAB IC 1-2 is adhered to a cap 1-9, and the cap 1-9 is adhered to the wiring circuit board 1-1, thus enabling the TAB IC 1-2 to be sealed. Also, a resistance element 108 can be formed instead of the capacity element 1-7 or in addition to the capacity element 1-7, thus enabling heat generated from the TAB IC to be radiated efficiently from a cap side. |
