INTEGRATED CIRCUIT DEVICE AND METHOD TO PREVENT CRACKING DURING SURFACE MOUNT

摘要

A semiconductor package device (20) is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe (23) having leadfingers (25), is an integrated circuit (21). The integrated circuit (21) has a polyimide coating (29) on its backside. An encapsulating material (26) surrounds the integrated circuit (21) and the lead-on-chip leadframe (13) so that the leadfingers (25) are exposed. The polyimide coating (29) on the backside of the integrated circuit (21) helps to reduce package cracking arising from mounting the device to a printed circuit board by reflow solder.