发明名称 |
Bonding pad for semiconductor devices |
摘要 |
A bonding pad is described having a reduced surface area while maintaining adequate wire bonding surface. The bonding pad comprises: a test pad for contacting with a test probe; a plurality of radially extending conductive fingers; and an alignment key generally in the form of a circle disposed about a portion of the fingers.
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申请公布号 |
US5053850(A) |
申请公布日期 |
1991.10.01 |
申请号 |
US19900614965 |
申请日期 |
1990.11.15 |
申请人 |
MOTOROLA, INC. |
发明人 |
BAKER, THOMAS R.;ANDERSON, GEORGE F. |
分类号 |
H01L23/482;H01L23/485 |
主分类号 |
H01L23/482 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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