| 摘要 |
PURPOSE:To remove an inductance unnecessary in a matching circuit resulting in easiness to take matching, by die-bonding the capacity for input matching on the conductive layer for a gate electrode. CONSTITUTION:The conductive layer 22 for a second drain electrode, the conductive layer 23 for a source electrode, the conductive layer 24 for a gate electrode and the conductive layer 25 for the first drain electrode are provided on an insulating substrate 21. The capacitor 26 for input matching is die-bonded in the neighborhood of the conductive layer 23 for the source electrode on the conductive layer 24 for the gate electrode. While, the capacitor 27 for output matching is die-bonded likewise in the neighborhood of the conductive layer 23 for the source electrode on the conductive layer 22 for the second electrode. By this constitution, since the parasitic inductance inserted in parallel to the matching circuit can be removed, the matching can be easily taken. |
