ELECTRONIC CIRCUIT UTILIZING SILVER DIFFUSED TRANSFER IMAGE FORMATION

摘要

PURPOSE: To obtain a silver circuit pattern having resistance against formation of a silver dendritic crystal by forming a silver pattern on a substrate by a silver diffusion transfer method, removing a layer containing silver halides, and subjecting the pattern to electric plating and electroless plating. CONSTITUTION: An insulating substrate is subjected to hydrophilic treatment to give hydrophilicity to the surface of the substrate. Diffusion transfer nuclei are applied without a binder on the hydrophilic part of the insulating substrate. A photosensitive material containing silver halide is formed as a layer on an insulating substrate which covers the diffusion transfer nuclei or on a second substrate. Then the photosensitive material layer is partly exposed to active rays. A developer is applied on the exposed layer to form a silver pattern as a coating film on the substrate by a silver diffusion transfer method while the surface part of the layer is brought into contact with the diffusion transfer nuclei. Then the layer in which the silver halide is originally included is removed while the silver pattern is left on the surface of the insulating substrate. Thereby, a conductive metal pattern having adhesion property is formed on the insulating substrate.