| 摘要 |
<p>PURPOSE:To form a very compact hybrid integrated circuit by a method wherein a hole is provided at a desired position on a case material, a microcomputer chip provided with a built-in EPROM is connected to a conductive path on a board exposed in the hole and peripheral circuit elements are mounted on the other region. CONSTITUTION:A hole 4 is provided at a prescribed position on a case material 7 fixed on integrated circuit board 2 and a microcomputer chip 6 provided with a built-in EPROM is mounted on a conductive path 5 on the board 2 exposed in the hole 4 and is connected with the path 5 adjacent to the chip 6. The placement position of this chip 6 can be arbitrarily set. Accordingly, the chip can be efficiently connected with circuit elements 8 most related to the chip 6. Thereby, a signal conductor, that is, the routing the conductive path can be made unnecessary. Moreover, all the circuit elements other than this chip 6 are mounted on the board by the chip and are housed in a sealed space which is formed of the board 2 and the material 7. Thereby, a small-sized and highly integrated packaging can be formed.</p> |
