| 摘要 |
PURPOSE:To make possible a laser trimming at high speed and with high accuracy by a method wherein after a simple function instrumentation is performed, a high-function instrumentation is performed and a function trimming is performed. CONSTITUTION:An electric signal is fed to a circuit board 1 to be trimmed by a probe part 5. A first target is set in a setting reference part 7 and a circuit resister is laser cut by a laser 3 until the output of the circuit 1 to be measured reaches a set reference in a comparison part 8. Then, the electric signal is measured by an instrument 6, the measured value is read in a control part 4, is compared using a software in the interior of the part 4, then, a length to be laser cut is calculated on the basis of a measured result and a laser cut is performed. In such a way, after a single function instrumentation is performed, a high function instrumentation is performed and a function trimming is performed. |
