| 摘要 |
PURPOSE:To prevent the increase of the number of external pins of a package by setting plural types of initial states with a single type of chip after connecting the pad of a semiconductor chip to a power lead or a ground lead of the package in an assembly state. CONSTITUTION:The leads 5 includes a power lead 5Vcc which supplies a power potential to a semiconductor chip 1c, a ground lead 5GND which supplies an earth potential, and a lead 5 which transmits the normal signals. Then a signal pad 2 of the chip 1c is connected to the lead 5Vcc or the lead 5GND of a package 3 in an assembly state. Thus one of plural initial states set previously to the chip 1c is selected and set. In such a constitution, the number of external pins can be decreased for an integrated circuit device. |
