DEPOSITION OF CONDUCTIVE METAL BY SOLUTION PROCESS

摘要

AST 5538 DEPOSITION OF CONDUCTIVE METAL BY SOLUTION PROCESS Thin metal films can be formed on a substrate by first coating the substrate with a solution comprising a solubilized metal source (e.g., copper) and a reducing alcohol (e.g., an alkoxyalcohol, an aminoalcohol), drying of the film solution to form a dried film, and heating of the film to reduce the metal to its elemental form.