| 摘要 |
PURPOSE:To improve the workability of a semiconductor element measuring device and to be adapted for an automation by providing a plurality of stationary substrates coindicing with an IC and monitoring pattern in a probing unit. CONSTITUTION:A wafer is placed on a stage 3' of a probing unit 4' mounted with stationary substrates 2a, 2b coinciding with an IC and a monitoring pattern. When the stage 3: is moved to contact the electrode of an IC with the multiprobe 1a of the substrate 2a, a contact signal of a probe 1a is inputted to a test unit 5' to measure the IC, thereby discriminating the propriety. When a monitoring pattern is presented in the course of measuring, the stage 3' is moved to contact the electrode of the monitoring pattern with the multiprobe 1b of the stationary substrate 2b for monitoring the pattern. In this manner, a program for the monitoring pattern associated with te unit 5' is started to collect the data. Thereafter, when the IC is again presented, the stage 3' is moved under the substrate 2a, thereby discriminating the propriety of the IC. |
