| 摘要 |
<p>PURPOSE: To enable correspondence to wafers of the diameters of sizes in a fixed range by a method, wherein stop pieces are simultaneously moved before and behind mutually counterposed to each other and the diameters of the wafers are selectively set at a prescribed point. CONSTITUTION: A wafer-centering device 33 is mounted to the upper part of a mounting plate 20, in such a way that a centering of wafers is performed on a vacuum head 31. The device 33 has a pair of stop pieces 34 provided on the opposite side to a passage, and the wafers are moved along the passage by a conveyor belt 13. The pieces 34 are installed in such way that they are respectively controlled by each lock screw 36 and are respectively mounted to the upper part of the free end of each rotting arm 35. Arm 35 is aligned with the upper part of a rotating pin 38 with a long groove 37, provided at the end part on the opposite side of the frame end. Moreover, a lock screw 39 is screwed into the arm 35 and penetrates the groove 37 is such a way that the groove 37 is closed. In this way, the screws 39 can be used to fix the arms 35 on the pins 38. By constituting a device 33 in this way, the device 33 can correspond to the wafers of the diameters of different sizes and can modify rapidly a setting of the diameters of the wafers.</p> |
