Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
摘要
The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
申请公布号
US5048744(A)
申请公布日期
1991.09.17
申请号
US19900522473
申请日期
1990.05.14
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
CHANG, CHIN-AN;KOOPMAN, NICHOLAS G.;ROLDAN, JUDITH M.;STRICKMAN, STEVEN;SRIVASTAVA, KAMALESH K.;YEH, HELEN L.