| 摘要 |
PURPOSE:To prevent a semiconductor element and a circuit board from being broken due to a thermal stress by a method wherein an insulative filler is impregnated in an insulative resin. CONSTITUTION:A first insulative resin 3 is applied on a semiconductor element 1 having bump electrodes 2 and a second insulative resin 5 with an insulative filler 4 dispersed therein is injected on a region, where the bump electrodes of the element 1 do not exist, to push away the resin 3. After that, the element 1 is mounted and pressed on a circuit board 6 in such a way that the electrodes 2 correspond to wiring electrodes 7 of the board 6, the resins 3 and 5 are hardened in a state that the element 1 in pressed and thereafter, the pressing is removed and the element 1 is connected to the board 6. That is, as the insulative filler is dispersed in the resin 5, the thermal expansion coefficient of the resin 5 is reduced. Thereby, when a temperature change is generated in the whole system, a thermal stress which is generated between the resin 5 and the element 1 or the board 6 can be reduced and the element and the board 6 can be prevented from being broken. |
