| 摘要 |
PURPOSE:To realize compactness and reduction of a process by providing a metallic cover for shield only to a semiconductor element part which requires shield effect among semiconductors and electrical parts mounted on an insulating substrate and by coating the entirety with resin. CONSTITUTION:A semiconductor pattern 2 consisting of silver-paradium is formed in a ceramic substrate 1 and a semiconductor element 3 is mounted to carry out wirebonding connection by a gold line 4. then, phenole resin 5 is applied for protection of the element 3 and left to stand for 1 to 3 hours in a constant temperature bath of 150 deg.C for heating and curing. Thereafter, a metallic shield cover 6 and a passive device 7 such as a resistance or capacitor, etc., are mounted and soldered by solder reflow method. Then, a clip terminal 8 is connected by solder to an external connecting terminal land which is formed in an edge part on the substrate 1. After phenole armor resin 9 is applied all over with a tip part of the teminal 8 exposed, heat treatment as the above is carried out. It is thereby possible to make a metallic case unnecessary and to realize compactness and reduction of a process. |
