发明名称 Method and apparatus for mounting an integrated circuit on a printed circuit board
摘要 Method and apparatus for creating an electrical connection between a tape-assisted bonding (TAB) segment having a plurality of conductive leads formed thereon and a printed circuit board also having a plurality of conductive leads formed thereon. A sheet of polymeric material having conductive elements mounted thereon so that each element protrudes from both sides of the sheet is disposed between a plurality of TAB segment leads and a corresponding plurality of generally opposing printed circuit board leads. A clamp secures the TAB segment to the printed circuit board thereby sandwiching the conductive elements between the TAB segment leads and the printed circuit board leads thus creating electrical connections between the opposing leads.
申请公布号 US5046953(A) 申请公布日期 1991.09.10
申请号 US19900529069 申请日期 1990.05.25
申请人 HEWLETT-PACKARD COMPANY 发明人 SHREEVE, ROBERT W.;DOBBS, MICHAEL D.;BURRIS, LUCY E.;FREUND, ROBERT B.;KEIL, RONALD W.
分类号 H01L21/60;H01R12/04;H01R13/24;H01R33/76;H05K3/32 主分类号 H01L21/60
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