Device for detecting height of bonding surface

摘要

A bonding height detecting device used in a wire bonding machine which includes a rotatable axle provided on a bonding head, a moving block pivotally mounted on the rotatable axle, a bonding arm fixed on the rotatable axle, and a bonding tool attached to one end of the bonding arm through which a bonding wire is passed. The detecting device includes a lever fixed on the rotatable axle and having a first stopper and a detecting surface, a second stopper fixed on the moving block so that the second stopper is urged to contact the first stopper, a sensor fixture attached to the second stopper, and a proximate sensor mounted on the sensor mixture and facing the detecting surface of the lever.