| 摘要 |
PURPOSE:To reduce bonding damage and obtain excellent bonding condition by relatively vibrating wire and a part to be bonded so as to be bonded by diffusion after a bonding load, which is changed by time, reaches a prescribed press-bond diameter. CONSTITUTION:A ball 5a is plastically deformed by a first bonding load W1 so as to reach a prescribed press-bond diameter and is controlled by a small second load W2 and vibration f1. Thus, even an Al pad 2a is pressed by the ball 5a, the bottom layer part 31 of the pad 2a maintains a prescribed thickness, new planes 32 and 33 are created and the ball 5a and the pad 2a are surely bonded. Then, a capillary 11 is energized with ultrasonic oscillation f2 and a lead 4 is heated by a heat block 7. Thus, the wire and the part to be bonded are relatively vibrated and are bonded by diffusion. |
