| 摘要 |
Metal substrates are given hard coatings by applying flexible mouldings contg. plastics (I), the hard material (II) and solder powder (III) and heating in vacuo or protective gas to the working temp. of the solder used. The novelty is that (I) is EVA, ethylene-propylene copolymers and/or butyl rubber and the moulding contains 5-40 vol.% (I) and 5-40 vol.% pores, rest (II) and (III). Pref., the moulding contains 40-70 vol.% (II) or (III), 10-25 vol.% (I) and 15-35 vol.% pores. The substrate is covered first with a (II) moulding and then a (III) moulding.
|
| 申请人 |
DEGUSSA AG, 6000 FRANKFURT, DE |
发明人 |
MUERRLE, DR. DIPL.-ING., ULRICH, W-6450 HANAU 9, DE;STARZ, DR. DIPL.-CHEM., KARL-ANTON, W-6458 RODENBACH, DE;SZULCZYK, DIPL.-ING., ANDREAS, W-6464 LINSENGERICHT, DE;NAUBER, DIPL.-ING., JUERGEN, W-6450 HANAU 11, DE |
