| 摘要 |
2077449 9112921 PCTABS00007 A device for applying a solder paste, a glue or another similar material in patches on a substrate (24) comprises a supply (10) of said material, an outlet (16), connected to said supply by means of a conveying conduit (14), and means (18) for intermittently forcedly discharging the material in successive small quantities through the outlet (16). In order to counteract any sedimentation within the conveying conduit (14), said conduit is formed as a closed loop which contains means (13) for feeding the material in a continuous circulating flow therethrough and past the outlet (16) which comprises a discharge opening (17), provided in the wall of the conveying conduit (14) and through which the material may be thrown out in small quantities by the aid of means (18) for intermittently transiently increasing the pressure in the conveying conduit (14) within a zone located adjacent to the discharge opeing (17).
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