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发明名称
RESIN SEALING SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH03200355(A)
申请公布日期
1991.09.02
申请号
JP19890241290
申请日期
1989.09.18
申请人
MATSUSHITA ELECTRON CORP
发明人
MURAMATSU TETSUO
分类号
H01L23/29;H05K1/02;H05K3/34
主分类号
H01L23/29
代理机构
代理人
主权项
地址
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