| 摘要 |
PURPOSE:To increase heat dissipating effect of semiconductor element, and utilize a mounting part as a stopper, by forming a semiconductor element mounting part by using a protruding type metal. CONSTITUTION:A wire bonding part 2 is formed on a thin PWB substrate 1 like a glass epoxy substrate. A semiconductor element mounting part 4 is a protruding type, the rear is made of Cu and protrudes from the rear of the substrate 1, a semiconductor element 3 is fixed on the mounting part 4 with adhesive 5 like Ag paste; after resin sealing using epoxy resin and the like, a metal cap 7 is bonded by using bonding resin 8, leading-out pins 9 are planted by a press. This constitution is excellent in heat dissipating effect, and the mounting part 4 serves as a stopper at the time of mounting. When a groove is formed on the rear of the mounting part 4, the heat dissipating effect is further increased. |
