| 摘要 |
A process for surface-treating copper products, for example, a copper foil to be used for a copper-clad laminate, the resulting surface-treated copper product having a superior bond strength to a base material, resistant to etching solution, acids, etc., is provided, which process comprises electrically depositing a binary alloy consisting of 95 to 20% by weight of zinc and 5 to 80% by weight of nickel, on the surface of a copper product to form a coating layer, followed by laminating the resulting copper product onto a base material under heating and pressure, said binary alloy being converted during the lamination into a ternary alloy of zinc, nickel and copper constituting a boundary layer having a superior bond strength between the copper product and the base material. |
