| 摘要 |
An integrated circuit is fabricated on a semiconductor substrate and comprises a plurality of component circuits having first and second circuits respectively serving as signal sources and a third circuit serving as a signal destination, an insulating film covering a major surface of the semiconductor substrate, and a plurality of wiring strips formed in the insulating film and having a first wiring strip interconnecting the first circuit and the third circuit and a second wiring strip coupled to the second circuit, in which the first and second wiring strips are arranged to be opposed to one another through the insulating film and in which the first and second wiring strips respectively propagate signals substantially in phase with one another, so that a parasitic capacitance between the first and second wiring strips are drastically decreased, thereby causing the signal propagations to be improved in speed.
|
