| 摘要 |
A process for forming a conductive coating on a substrate comprising (1) applying an electrically conductive material to the surface of an uncured or a partially cured organic resin having a tacky surface said resin being patterned circuitwise on a substrate and, thereafter, in either order, (2) curing said resin to fix the electrically conductive material in position on said surface by either heat or UV radiation, preferably in an inert atmosphere, e.g., nitrogen, and (3) removing any loose electrically conductive material. |
