| 摘要 |
<p>A substrate for electronic components has a layer of material covering at least a portion of the substrate. Recesses are formed in a layer of material and located in a pattern relative to each other to form a predetermined temperature distribution across the layer of material. The layer of material can be formed as a resistive film for a heating resistor element. The shape, size and pattern of the recesses are selected to balance the thermal stress across the surface of the layer of material.</p> |
