| 摘要 |
PURPOSE:To enable a very fine and thin outer lead manufactured through a TAB method to be surely bonded to a board by a method wherein a heated thermocompression bonder is made to press the outer lead of a semiconductor chip and then made to stop pressing. CONSTITUTION:A suction part 4 is made to descend, a semiconductor chip P is mounted on a board S, and an outer lead L is brought into contact with an electrode of solder formed on the upside of the board S. A rod 25 of a multistage cylinder 24 is made to protrude feebly to make a thermocompression bonder 7 descend, an arm 15 is rotated by a spring force of a spring member 18, whereby a pressing part 7b is weakly pressed against an outer lead L, and when a heat transfer part 6 comes into contact with the thermocompression bonder 7, the protruding force of the rod 25 is increased, and the pressing part 7b is strongly pressed against the outer lead L. Cold air is made to blow off from the lower end of an upright tube 2 through which a nozzle shaft is made to penetrate to cool down the electrode, and when there is no fear that the outer lead L springs up, the thermocompression bonder 7 is made to ascend to stop pressing the outer lead L. |
