| 摘要 |
A package (10) for housing fabricated semiconductor chips (12) is disclosed. The package has ceramic base (16) with a raised outer shelf extending around its periphery. The outer shelf defines a space in the package where the chip is seated. A lead frame with a number of individual conductive leads (28) is disposed over the outer shelf. A section of tape automated bonding tape (30) is used to provide electrical connections between bonding points on the chip and the lead frame leads; the tape automated bonding tape carries a number of conductive leads each of said leads having an inner lead portion attached to a chip bonding point, and an outer lead portion attached to a lead frame lead. A frame (44) is secured over the base outer shelf so the lead frame is embedded therebetween. A lid (50) is secured over the frame to completely enclose the chip within the package. An adhesive that can be cured at a low temperature so as to not delaminate the tape automated bonding tape, is used to secure the frame and lead frame to the base, secure the chip in the space and secure the lid to the frame. |
