| 摘要 |
PURPOSE:To realize the reduction of manufacturing cost, the luminous intensity elevation, and the thinning by providing it with a lead frame planted and an LED chip bonded in the specified position of the lead frame, and forming the body integrally. CONSTITUTION:This is composed of a body 50 made of resin and plural pieces of leads projected from this body 50. In the body 50, seven segment holes 51a-51g corresponding to 8 to numerical and a decimal point hole 52 corresponding to. of decimal point are opened, and transparent resin is filled in the holes 51a-51g and 52. In this case, the lead frames 11 are planted in the body 50, and besides the body 50 is made integrally. Hereby, the strength of the lead frames improves, and also light does not leak from the rear of the body, and the manufacturing cost can be reduced. |
