发明名称 CONDUCTIVE PATTERN FORMING COMPOSITION AND METHOD OF PRODUCING THE SAME.
摘要 <p>A conductive pattern forming compsn. contains, as major components, (a) an alloy powder, (b) a glass fit and (c) an organic vehicle. (a) is obtained by pulverising finely a cooled eutectic mixture of Ni (99.5-94.5 pref. 98.5-96.0 wt.%, best 98.0-96.3 wt.%) and B (0.5-55 wt.%, pref. 1.5-4.0 wt.%, best 2.0-3.7 wt.%). The particles of (a) are spherical, of dia 10 microns. The softening pt. of the glass frit, which lies between 400-500 deg.C, is higher than the decomposition temp. of the organic vehicle. The weight ratio of alloy powder to glass frit is 1-40. The conductive pattern is formed by kneading the mixture of (a), (b) and (c), making it into a paste, using a printing technique to print a pattern of the paste on the substrate, and then baking. The alloy powder can be obtd. by a water atomising method. The conductive pattern is also obtd. by making a toner by mixing the alloy powder coated with an insulating layer with the glass frit also coated with an insulating layer, transprinting the pattern on the substrate with the toner using a static electric technique, and baking. The conductive pattern can be produced on a plasma display substrate.</p>
申请公布号 EP0440822(A1) 申请公布日期 1991.08.14
申请号 EP19900912958 申请日期 1990.08.30
申请人 DAI NIPPON INSATSU KABUSHIKI KAISHA 发明人 HIGUCHI, NAOSHIGE DAI NIPPON INSATSU K.K.
分类号 C03C8/18;C09D11/00;C09D11/52;C22C19/00;H01B1/02;H01B1/16;H01B1/22;H01B5/00;H01B5/14;H01B13/00;H01J1/48;H01J9/02;H01J9/14;H01J11/24;H01J17/04;H05K1/09;H05K3/12 主分类号 C03C8/18
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