| 摘要 |
An improved method for producing a gold conductor on a substrate in the manufacture of a thick film hybrid circuit, such that the gold conductor is suitable for wire bonding. The method comprises screen printing a fluxless gold paste on the substrate, and then firing the substrate and paste. The paste includes the resinate of a metal that can form an alloy with gold and that can also form an oxide at the firing temperature. Suitable gold pastes include bismuth and cadmium resinates in a total amount by weight of less than 1%.
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