| 摘要 |
PURPOSE:To sharply enhance the hardness at a high temperature after hardening, to enhance a wire bonding property and to obtain a device whose reliability is high by a method wherein an insulating adhesive which fixes and bonds an insulating substrate onto a bed contains a metal whose surface is provided with an oxide film other than a silicon oxide. CONSTITUTION:In a device where a semiconductor pellet and an insulating substrate 2 have been mounted respectively on a bed 1a of a lead frame 1, the insulating substrate 2 is fixed and bonded onto the bed 1a by using an insulating adhesive 3, and the insulating adhesive 3 contains a metal whose surface is provided with an oxide film other than a silicon oxide. Since the insulating adhesive contains the metal in addition to the silicon oxide in this case, the content by percentage of a filler becomes high and the hardness after hardening is enhanced. When a filling rate is increased, a wire bonding operation can be executed at an optimum temperature. In this manner, sufficient hardness is obtained even at a high temperature after hardening, and an excellent wire bonding property and high reliability are provided. |
