| 摘要 |
PURPOSE: To obtain a reliable high-density multiple-chip assembly by forming the assembly with an integrated circuit carrier, an integrated circuit chip, a connection post for connecting them with an interval, and a flexible joint for connecting the connection post to a constituent elements of a set consisting of the carrier and the chip. CONSTITUTION: An assembly consists of an integrated circuit carrier 102, an integrated circuit chip 104 in a flip chip being arranged with respect to the carrier 102, a connection post 376 that mechanically and electrically connects the carrier 102 and the chip 104, has a shaft for prescribing an axial direction, and arranges the chip 104 from the carrier 102 in the axial direction with a gap, and flexible joints 226 and 342 for connecting the connection post 376 to a constituent of a set consisting of the carrier 102 and the chip 104, so that the connection post 376 can be moved in the axial direction and at the same time, can be inclined with respect to the shaft. When the carrier 102 and the chip 104 undergo different thermal expansion, the post 376 is made to move so as to reduce the shearing strain in a surface that is vertical to the above axial direction and is along the post 376. |
