发明名称 DEVICE FOR REMOVING STRAIN OF BAND SAW
摘要 PURPOSE:To efficiently remove strain of a band saw in a simple manner by providing a device to measure strain of the surface of the band saw and a device to apply laser beam having energy density corresponding to the strain to a part where deviation from a reference surface of the surface of the saw exceeds an allowable value. CONSTITUTION:Feed speed of a band saw 1 is detected by a detector 30 whose output is sent to a laser beam controller 50. A strain detector 10 scans the surface of the saw 1, while a laser beam radiator 20 for removing strain also moves forward and backward in a width direction of the saw synchronously with the detector 10. A strain decision circuit 4 calculates the strain of the surface of the saw to input the data calculated into the controller 50 which in turn controls the output of the radiator 20. The controller 50 controls the radiator 20 in such a manner that pulse density becomes higher where strain is large and becomes lower where strain is small. The saw is heated locally and when it cools, it is subjected to a strong peripheral tension, whereby strain of the saw is rectified and its flatness is restored.
申请公布号 JPH03175001(A) 申请公布日期 1991.07.30
申请号 JP19890314317 申请日期 1989.12.05
申请人 ROMATETSUKU KK 发明人 INOUE KIYOSHI
分类号 B27B13/16;B21D1/00;B21D1/06;B21D3/00;B23D63/18;B23K26/02;B23K26/03 主分类号 B27B13/16
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