发明名称 A METHOD OF ENCLOSING A SUBSTRATE
摘要 <p>A method of enclosing a substrate within a heat-shrinkable sleeve, which comprises the steps of: (a) attaching to the substrate a slideway; (b) attaching to the slideway a clip having at least two legs; (c) positioning a heat-shrinkable sleeve around the substrate; (d) sliding the clip by means of the slideway and with respect to the substrate such that at least one portion of the sleeve becomes positioned between the legs of the clip, and (e) causing heat-shrinkage of the sleeve.</p>
申请公布号 WO1991010355(A1) 申请公布日期 1991.07.25
申请号 GB1991000036 申请日期 1991.01.11
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