| 摘要 |
<p>The Combi-Film-Hybrid (CFH) technology combines multilayer thick-film and thin-film on the same substrate to build high-density interconnections with integrated resistors for multi-chip modules. The technology is based on two or more multi-layer thick-film conductor layers with printable thick-film dielectric layers between the conductors including via-holes and with one or more thin-film signal interconnection layers on top of the thick-film structure using thick-film or glass between the last printed thick-film conductor and the thin-film, and with polyimide dielectric between the thin-film layers. All dielectric layers include via-holes. Each thin-film layer consists of a resistive film, a diffusion barrier film and a conductive film photopatterned to include thin-film resistors. Transmission lines for critical signals are built of thin-film and by using the underlaying thick-film layer as reference plane and hereby making possible design of high-density interconnections with characteristics impedance matched to the integrated circuits being used, to the package itself and outside interconnection.</p> |
