Semiconductor wafer.

摘要

Upon the making of a die-sort testing for a predetermined IC pattern formed on each chip area (12), a plurality of sets of output pads (13) selectively supplied with output signals are formed on the chip area (12) and connected with a connection pattern (14) on a dicing line area (11), and one testing pad (15) is provided for the respective set of the pads. The IC patterns are tested by electrically contacting the testing pad (15) with corresponding probe needle of probe card in a die-sort machine. <IMAGE>