| 摘要 |
<p>PURPOSE:To obtain high insulation reliability without generating the possibility of insulation inferiority by providing an insulating film between a printed wiring board and an electronic part and fixing the electronic part to the printed wiring board through the insulating film. CONSTITUTION:A printed circuit board 12 as a printed wiring board is constituted by bonding a copper wiring pattern on a substrate base material 13 by an adhesive. The wiring pattern 14 is also formed in a part where the LSI chip 1 on the printed circuit board 12 is fixed. An insulating film 17 is bonded to the wiring pattern 14 by an adhesive 16 and the LSI chip 11 is bonded by an adhesive 18 through the insulating film 17 to be fixed on the printed circuit board 12. The resin insulating film 17 has mechanical strength and dielectric strength higher than those of a film of insulating paint and has no pinhole. Therefore, when the printed circuit board 12 has flexibility or even when bending force or external force is applied to the printed circuit board 12 at the time of the mounting of the chip 11, the insulating film 17 is not damaged or torn by the corner of the LSI chip 11.</p> |
