| 摘要 |
PURPOSE:To mount a semiconductor device of a multipin and small-scale gate type on a multipin package and to avoid an increase in an area by a method wherein a region for relay use in order to bond a pad on the semiconductor device to an inner lead pin is formed on a die pad of a lead frame. CONSTITUTION:A relay region for a wire bonding operation is formed on a die pad part of a lead frame; when a pad on a semiconductor device and an inner lead pin cannot be bonded due to a limitation of a wire length, the pad on the semiconductor device is first bonded to the relay region and then bonded to the inner lead pin. For example, an insulating layer 3 is formed on a die pad part 2; a relay region 4 is formed on it; a pad 7 on a semiconductor device 6 is first bonded to the region 4 by using a bonding wire 8; then, the region 4 and the inner lead pin 1 are connected by using a bonding wire 9. |
