发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 PURPOSE:To input and output a signal stably and surely by a method wherein an insulating substrate and a lid body are formed of an Al2O3 sintered substance, an external lead terminal is formed of a metal whose coefficient of thermal expansion is specific/ deg.C and whose electric conductivity is specific % or higher and a glass member is formed of PbO2, ZnO, SiO2 and alumina which are respectively at specific %. CONSTITUTION:Recessed parts which form a space used to house a semiconductor element are formed in respective central parts of an insulating substrate 1 and a lid body 2; the semiconductor element 5 is attached and fixed to the bottom of the recessed part of the substrate 1 via an adhesive such as a resin, a glass, a brazing agent or the like. A coefficient of thermal expansion of an aluminum oxide sintered substance used to form an insulating container is 65 to 75X10<-7>/ deg.C; glass members 6, for sealing use, which are applied to opposite main faces of the substrate 1 and the lid body 2 are formed of a glass which is composed of the following: 60.0 to 80.0wt.% of lead oxide; 5.0 to 20.0wt.% of boron oxide; 5.0 to 20.0wt.% of zinc oxide; 1.0 to 10.0wt.% of silica; and 1.0 to 10.0wt.% of alumina. Thereby, even when the semiconductor element housed inside the insulating container is operated at high speed, a signal is input and output stably and surely between the semiconductor element and an external electric circuit.
申请公布号 JPH03167846(A) 申请公布日期 1991.07.19
申请号 JP19890308607 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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