| 摘要 |
<p>PURPOSE:To reduce the number of pins used for a high drive output terminal to accommodate them in a package smaller than normal one by providing bonding regions for an integrated circuit board potential and a potential different from an integrated circuit board potential between a semiconductor integrated circuit and an inner lead pin. CONSTITUTION:A lead frame is separated at its die pad into three regions of land 303, 306 for a high power driver and a land 304 for a ground. In a bonding diagram of an integrated circuit 401 when the frame is used, pads 402, 403 for a high power driver are bonded to the lands 404, 405 for a high power driver. Accordingly, even if the high power driver is realized, it can be coped with one inner lead pin 408. Thus, the number of outer terminals of a package is reduced, and accommodated in a package smaller than normal one.</p> |
