发明名称 COOLING DEVICE FOR LASER PROCESSING EQUIPMENT
摘要 PURPOSE:To perform anticorrosion treatment for a metal in a cooling water supply system without acidifying cooling water by making discharge laser gas pass through a gas-liquid contact device for absorbing CO2 gas to allow the above device to separate and absorb CO2 gas and supplying discharge laser gas consisting of a gas mixture mixed mainly with N2 and He to a gas-liquid contact device for degassing dissolved oxygen. CONSTITUTION:Discharge laser gas produced by a gas laser oscillator 1 is allowed to blow off from a sparger 19 into water located in a gas-liquid contact device 17 for absorbing CO2 gas. Then, CO2 gas contained in discharge laser gas is dissolved and absorbed in water and discharge laser gas from which CO2 gas is removed is obtained at a port 23 for taking off gas and further, gas in the port 23 for taking off gas has He as its main ingredient. Such an inactive gas is fed to a cooling water return passage 9 through a passage 25 and moves to a bubbling vessel 27 while coming into contact with cooling water. Then, dissolved oxygen in cooling water is degassed to lower concentration of dissolved oxygen in cooling water. In such a case, the cooling water return passage 9 serves the purpose of a gas-liquid contact device for degassing dissolved oxygen as well.
申请公布号 JPH03165082(A) 申请公布日期 1991.07.17
申请号 JP19890303093 申请日期 1989.11.24
申请人 AMADA CO LTD 发明人 SEKAI KOUJI
分类号 B23K26/00;H01S3/036;H01S3/041 主分类号 B23K26/00
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