| 摘要 |
Polyethylene compositions containing from 0,001 to 0,15 parts by weight of an unsaturated fatty acid amide having 18 to 22 carbon atoms with a M.P. between 20 DEG and 75 DEG C. and B.P. of over 225 DEG C. e.g. amides of oleic and erucic acids; from 0,001 to 0,15 parts by weight of a saturated fatty acid amide having 10 to 22 carbon atoms with a M.P. between 70 DEG and 150 DEG C. and B.P. of over 225 DEG C., e.g. amides of palmitic and stearic acids; from 0,001 to 1,0 part by weight of and antioxidant; from 0,01 to 0,5 parts by weight of a siliceous matter with average particle size between 0,5 and 7,0 microns; and from 0,5 to 10 parts by weight of a polyethylene having a melt index at least 10% higher than the melt index of the polyethylene base resin which has melt indices from 0,5 to 12 and is used in an amount sufficient to make 100 parts by weight of the total composition. The antioxidants may be di-t-butyl-p-cresol, di-t-butyl-4-methoxyphenol, N, N1-diphenyl-p-phenylenediamine, and 4, 41-thiobis (6-t-butyl-m-cresol) and the fillers mentioned are diatomaceous earth, commercial silicas and silica gel. The polyethylene with the higher melt index may be obtained by thermally or mechanically degrading the base polyethylene, or may be a separate polyethylene of different melt index. Improved dispersion is obtained when the composition is prepared as a concentrate to be added to the base resin. Films prepared from the composition show improved blocking resistance, slip characteristics, electrostatic properties and extrusion. |
