摘要 |
An apparatus for positioning printed-wiring substrates of different sizes comprising: an X-Y table having a movable device movable along X and Y axes; a pair of Y-axis positioning members which are disposed on the movable device and relatively movably spaced from each other along the Y axis, so as to be engageable with opposite parallel sides of the substrate parallel to the X axis, for positioning the substrate along the Y axis; an X-axis positioning member provided on the movable device and engageable with the substrate to position the substrate along the X axis; a first engagement member provided on at least one of the the Y-axis positioning members; a second engagement member which is fixed in position in the Y-axis direction; and a driving device for moving the first and second engagement members toward each other along an axis perpendicular to the Y axis, and effecting engagement of the first and second engagement members with each other, to thereby hold the above-indicated at least one Y-axis positioning member fixed in the Y-axis direction, and permit a change in relative position between the at least one Y-axis positioning member and the movable device along the Y-axis through a movement of the movable device along the Y axis. |
申请人 |
FUJI MACHINE MFG. CO., LTD., CHIRYU, AICHI, JP |
发明人 |
ASAI, LTD., KOICHI C/O FUJI MACHINE MFG.CO.;TSUDA, LTD., MAMORU C/O FUJI MACHINE MFG.CO.;KODAMA, LTD., JIRO C/O FUJI MACHINE MFG.CO., CHIRYU-SHI AICHI-KEN, JP |