发明名称 |
Method for laser link blowing in integrated circuit fabrication. |
摘要 |
<p>A single beam of radiation is split and part of the beam is directed to conductive links, e.g. runners, on a substrate. Analysis of the incident beam and the beam reflected from the substrate permits a determination of when the link is blown and rendered non-conductive and when significant substrate involvement occurs. <IMAGE></p> |
申请公布号 |
EP0435469(A2) |
申请公布日期 |
1991.07.03 |
申请号 |
EP19900313005 |
申请日期 |
1990.11.29 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
CHLIPALA, JAMES D. |
分类号 |
H01L21/822;H01L21/768;H01L21/82;H01L23/525;H01L27/04;H01S3/00 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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