| 摘要 |
<p>An electrical circuit pattern is formed on a glass-ceramic, thermally fusible tape. The tape is heated to a temperature at which it becomes temporarily plastic, and is then bent into a desired non-planar shape. Further application of heat causes the tape to be sintered in the non-planar shape. A multi-layer structure can be provided by laminating plural layers of Low-Temperature-Cofired-Ceramic (LTCC) tape with respective circuit patterns formed thereon together, and plastically bending the laminated structure into the non-planar shape during the heating step. A circuit structure including an edge connector can be formed by laminating a layer of glass-ceramic transfer tape having an electrical circuit pattern which includes conductor strips formed on an edge connector portion thereof onto a relatively rigid substrate, such that the edge connector portion is bent around an edge of the substrate to form a rigid edge connector. The edge connector portion of the transfer tape which is formed into a non-planar shape during the lamination step, is fused together with the remaining portion of the transfer tape onto the substrate during the heating step.</p> |
