| 摘要 |
PURPOSE:To sufficiently manage the thickness of an insulating film by forming a film thickness checking hole simultaneously when viaholes for connecting between wiring films are formed at the film, and knowing the thickness of the film formed by measuring the depth. CONSTITUTION:Photosensitive organic insulating films 1b and a wiring film 1c are alternately laminated on a power source board 1a. When the films 1b and 1c are alternately laminated, viaholes 1bc for electrically connecting the film 1b to the film 1c are formed, and a film thickness checking hole 1d is simultaneously formed. The depth of the hole 1d, i.e., the thickness of the film 1b is measured in contact with the contact stylus, etc., of a film thickness measuring unit. If the thickness is improper, the improper film 1b is peeled at this time, and the film is reformed. Thus, the thickness of the film 1b can accurately by managed and formed. |
