SOLDER PADS FOR USE ON PRINTED CIRCUIT BOARDS

摘要

Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas (12, 14) per lead, separated by a space of non-wettable material (16) so that during component placement on the soldered areas there is a tendency for the components to self centre as the leads fall between the raised soldered areas where they are retained during a reflow operation.