| 摘要 |
A packaging material for photosensitive materials which comprises packaging material which comprises a coextruded multilayer light-shielding film comprising an ethylene copolymer resin layer containing more than 30 wt. % of ethylene copolymer resin and an antioxidant, a thermoplastic resin layer having a melting point higher than said ethylene copolymer resin layer, and an adhesive thermoplastic resin layer containing a conductive material disposed between said ethylene copolymer resin layer and said thermoplastic resin layer. In the packaging material of the invention, the ethylene copolymer resin layer improves physical strength such as tear strength and heat sealing properties, and the thermoplastic resin layer makes heat sealing easy due to its heat resistance and improves bursting strength. The adhesive thermoplastic resin layer secures antistatic property and light-shielding, and it also improves the bonding strength between the ethylene copolymer resin layer and the thermoplastic resin layer. The packaging material of the invention hardly curls and is excellent in moistureproofness, gas barrier, physical strength, heat sealing properties and antistatic property. Nevertheless, the packaging material of the invention is inexpensive.
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