| 摘要 |
PURPOSE:To prevent an erroneous operation caused by power source noise by the integrated circuit itself and to easily perform a high density mounting and miniaturization of the device by a method wherein a capacitor, to be used for prevention of noise, is sealed in the itegrated circuit. CONSTITUTION:The terminal of a chip capacitor 1 of comperatively large capacity, to be used for prevention of power source noise, is bonded on the power source for the pin, to be used for the bonding of an IC chip 2, and the terminals 3 and 4 corresponding to a ground wire. The above is sealed in the IC together with the IC chip 2 and an IC package is formed. Besides, 5 is used as an outer terminal and the package has sufficient space wherein the chip capacitor will be sealed. Through these procedures, the capacitor used to prevent an erroneous operation is unnecessitated, and the high density mounting and the miniaturization of the device can be accomplished. |
